In the process of LED lighting, it is necessary to convert electrical energy into light energy, but it cannot completely convert electrical energy into light energy. Only a small portion of electrical energy can be converted into light energy, while the remaining majority of electrical energy is converted into thermal energy. For high-power LED devices and lighting fixtures, as the power continues to increase, the temperature of the internal chips of the LED will gradually increase, which will directly affect the lifespan of the components and also affect the brightness of the LED fixtures. Therefore, the heating problem is an urgent issue to be solved in the development process of LED.
At present, there are many cooling methods for LED lighting devices, which can be divided into packaging level cooling and lamp level cooling, with lamp level cooling being the most common. The lamp level heat dissipation method refers to the method of implementing heat dissipation through the heat interface material during the transfer process from the packaging substrate to the external heat sink.
In the LED driver power supply, the temperature of transformers, ICs, and capacitors is very high. When the temperature of electrolytic capacitor rises by 10 ℃, its life will be halved. The use of thermal conductive potting adhesive can effectively transmit the temperature of the power supply to the shell. After potting, the temperature inside the power supply can be reduced by more than 10 degrees (the degree of cooling varies depending on the size of the volume). For situations where space is small but high-power LEDs need to be driven, the thermal conductivity is greater than 2.0W/m * K. TGF-20 series products can be used for a long time in environments ranging from -50 ° C to+180 ° C. They not only have good thermal conductivity, flowability, mechanical properties, aging resistance, but also have good resistance to poisoning.
Applying appropriate thermal conductive silicone grease between the LED aluminum substrate and the heat sink can effectively fill the gaps between the interfaces, thereby achieving good thermal conductivity. Thermoacoustic has a series of ultra-low thermal resistance thermal conductive silicone greases, especially products with thermal conductivity coefficients ranging from 3.0W/m · K to 6.0W/m · K, which are very suitable for high-power COB products. The thermal conductive silicone grease produced by thermoacoustic research and development has a low volatility and a viscosity range suitable for processes such as dispensing and screen printing. Usually, the applied thickness is as low as 0.02 microns. In addition, silicone grease does not dry out after prolonged use and has excellent aging resistance.
Thermal conductive silicone sheet in the power supply
