Application of Thermal Conductive Materials in 5G

At present, 182 operators from 78 countries around the world have started 5G construction or are conducting 5G network testing, and some countries have even achieved trial commercial use of 5G in some regions. The curtain of the 5G era has gradually opened, and the research heat of new materials applied in 5G communication has already increased. This article mainly analyzes 5G thermal and heat dissipation materials. A significant feature of the 5G era is a significant increase in heat generation. As power consumption increases, the requirements for heat dissipation become more stringent, and new thermal and heat dissipation materials are also widely used.
5G base stations have indeed shown significant improvements in transmission power, bandwidth, and user connections compared to 4G. However, upon examining the power consumption comparison tests of 4G/5G devices, it can be found that the single station power consumption of 5G base stations is approximately 2.5-3.8 times that of 4G single stations! Industry insiders claim that the significant increase in AAU power consumption is the main reason for the increase in 5G power consumption. The left image shows the application of thermal conductive pads in the 5G antenna. Our company produces 5-10W high thermal conductivity silicon film, which has excellent aging resistance and adhesion.
Huawei's 5G chips will consume 2.5 times the power of current 4G modems, requiring more and better cooling modules to prevent phone overheating. From the perspective of mobile phone structure, the back cover is an important heat transfer path for mobile phones. However, due to the fact that metals in the 5G era will no longer be suitable, the thermal conductivity of glass materials is significantly different from that of aluminum alloys, so additional heat dissipation design needs to be added. For example, in the iPhone XS, in order to ensure better heat dissipation of the double-layer motherboard, very large pieces of heat dissipation graphite are pasted on the front and back of the motherboard, At the same time, the A12 chip on the motherboard is also coated with a large amount of thermal conductive silicone grease for heat dissipation.
TOSA and ROSA are the main components for achieving photoelectric conversion, which generate a lot of heat when processing photoelectric signals and require thermal design treatment. They often use coaxial packaging and box packaging. Both of these packaging methods require thermal conductive interface materials (such as thermal conductive gel, thermal conductive silicone grease, thermal conductive silicone chip, etc.) to be filled between the metal heat sink and the shell to improve the thermal conductivity and heat dissipation effect. The heat dissipation of devices on PCB boards and IC control chips also requires thermal conductive interface materials (such as thermal conductive silicon film, thermal conductive silicone grease, etc.) to transfer the heat of the heating element to the shell or heat sink, thereby improving the efficiency and service life of the heating electronic components.