Thermal Conductive Potting Adhesive

Name: Thermal Conductive Potting Adhesive
Brand: Thermal interface material (TIM) | Thermal pad | Thermal grease | The
Availability: InStock
Rating: 5 (1 reviews)

Thermal Conductive Potting Gel is a one-to-one ratio, two-component electronic sealing fluid with a thermal conductivity of 1.0W/M.K. It does not corrode the electronic components, adhesive to steel, aluminum, copper, tin, rubber, plastic, wood and more. After solidification, it will not run out from the point of construction regardless the cool or hot temperature. This potting material allows the electronic components and circuits to be free from the vibrative damages.

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Features: thermal conductivity: fliud adhesive gel 0.8 ~ 3.6W/m.K, electronic insulative thermal conductive sealant.

Applications: electric vehicle (EV) batteries, 5G, autopilot system, mobile phone, AIOT, HPC (high performance computing), server, IC, CPU, MOS, LED, mother board, power supply, microinverter, LCD-TV, notebook, PC, telecom device, battery energy storage system, wireless Hub, DDR ll Module, mechatronic drive systems.

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SPECIFICATION

Characterisc	Before curing				After curing
Characterisc	Appearance	Viscosity	Operational time	Initial curing conditions	Thermal conductivity	specific gravity	Hardness	Electrical breakdown strength
Unit	/	cp·s	min	/	W/mk	g/cm³	shore	KV/mm
Standards	Visual	ASTM D2196	Finger touch method	/	ASTM D5470	ASTM D792	ASTM D2240	ASTM D149
RS4111	Component A : White fluid Component B : Black fluid	ComponentA :6k-7k Component B :6k5-7k5 Mixed viscosityt:6k-7k	120@25°	3Hrs@25°C 30min@100°C	0.75	1.7	61	>20
RS411	Component A : White fluid Component B : Grey fluid	A:6k-1w B:3k5~7k Mix:4k5-8k	105@25°	4Hrs@25°C 30min@100°C	1.10	2.2	20	≥10
RS421	Component A : White fluid Component B : Grey fluid	Component A : 8k-1w Component B :8k5-1w Mixed viscosity.8k-1w	120@25°C	3Hrs@25°C 30min@100C	2.50	2.9	55 shore OO	≥15
RS4113	Component A : Black fluid Component B : Brown fluid	Component A :1w3-1w5 Component B : 1k1-1k3 Moed viscosity : 7k-8k	30@25°	1Hr@25°C	0.41	1.4	92	>20

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us for more information.

* Product Note

Packing specification

50ml (25ml each part);

400ml (200ml each part);

20kg (10kg each part).

Directions for use

• Working time @25℃ : 30 – 120 min;

• For best results, ensure a 1:1 mix ratio is maintained;

• Full cure @25℃ : 4 hours;

• Full cure @100℃ : 5 minutes.

Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.