• RS6000-Pad30 Series Thermal Pad
  • RS6000-Pad30 Series Thermal Pad

RS6000-Pad30 Series Thermal Pads

RS6000-Pad30 is a series of extremely soft gap-filler pad that maintains exceptional thermal conductivity. Pad30 accommodates the manufacturing design requirements and specifications of the materials engineers. In such case, the tech team can fully dedicate in their development, and our supplies will take care of the rest. 

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Features: soft and highly compliant, self-adhesive, easy-to-apply.

Applications: industrial LEDs, power supplies and conversion, PCB, laptop, chipset, M.2 heat sink, super charge, IPC and medical power supplies, packaged modules, DIN rail power supplies, DC/DC converters and modular DC UPS systems.
  • RS6000-Pad30 Series Thermal Pad

SPECIFICATION

Attribute
Value Test Method
Composition
Ceramic Filler + Silicone -
Color
Light Blue Visual
Thickness(mm)
0.5-10.0 ASTM D374
Density (g/cc)
3.0 ASTM D792
Hardness (shore oo)

55 shore OO (Thickness≤1.0)

  50 shore OO (Thickness>1.0)

ASTM D2240
Usage Temperature (C)
-60~+200 -
Electrical
Breakdown Voltage (kV/mm)
>6.0 ASTM D149
Dielectric Constant @1MHz
7.3 ASTM D150
Volume Resistivity (Ω.cm)
10^12 ASTM D257
Flammability
V-0 UL 94
Thermal
Thermal Conductivity (W/m.K)
3.0 ASTM D5470

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us for more information.

* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.

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Thermal Pad Manufacturer(TPHI)

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.

Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.

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