RS6000-Pad10 series of thermal conductive pads are very cost-effective interface materials. Natually soft with their adhesive micro-stickiness, they are quite easy to assemble. They present good thermal conductivity and electrical insulation properties under low compressing force. Embedding on the gap between the heat device and the heat sink or the machine shell can be helpful to extrude air and reach the full adhesion, forming a continuous thermal conduction.
Working on it under -40 to 200 degree celsius is the most ideal, and this material meets the flame retardant grade V-0 of the UL 94 standards.
Features: thermal conductivity 1.0-15W/m.K, ultra soft, excellent compressibility, UL and RoHS compliant.
RS6000-Pad100 are our thermal conductive gap-filler pads with a thermal conductivity of 10.0W/m.K, low thermal resistance, and excellent electrical insulation at low compression. It performs well under -40 to 150 degree celsius, and this model meets the flame retardant grade V-0 of the UL 94 standards.——————————————————————————————————————————————————Features: 10.0W/m.K high performance thermal pad, high electrical insulation, wide temperature range of operation, high compression ratio.Applications: VRMs, ASICs and DSPs, Network Communication Devices, BGAs, CD ROM/DVD ROM, Automotive Radar.
RS6000-Pad20 Gap-Filler Pads allow you to not only retain the thermal performance, but also give you a leeway to customize your pad shapes. You may include additional punch holes at 2.0W/m.K, and you may tailor the pads to the satisfactory level as long as the design drawings are provided.
——————————————————————————————————————————————————Features: soft and highly compliant, self-adhesive, easy-to-apply.Applications: electro-optical and radar sensors, navigation systems, inertial sensors, GNSS and robotics, speed sensors, displays, embedded computers, power control & conditioning systems, RF & microwave products, networking and telecommunications, notebooks, tablets, power conversion, SSD, NVMe, VAM, VRAM, heat sink, EMS, ITM, MCU.
Single Component Thermal Conductive Gel is a type of thermal interface material which hardness lies between the thermal grease and thermal pads. It is more reliable than the thermal grease, and it lowers the thermal impedance of the thermal pads.
_____________________________________________________________________________________________Features: 1.0 ~ 8.0 W/m.K, no cure required, highly compliant, low pressure vs deflection, liquid adhesive.Electronic components:
Typical Applications:
Standard dc/dc power converter and dc/ac inverter,
High performance CPUs
Between any heat generating semiconductor and heat sink
Custom power modules
Telecommunications and automotive electronics
Our one-component RS-UV7310 UV Acrylic Adhesive has a fast curing rate, high bonding strength, adequate flexibility of the cured-adhesive layer, ability to withstand high impact force, excellent aging resistance, water resistance, and freeze & heat resistance.
Thermal Conductive Silicone Grease is a kind of soft interface material exhibiting high thermal conductivity, which can effectively reduce the thermal resistance between the radiator and the heat source when contacting. It is suitable for applications requiring minimum compression thickness, constant pressure and easy screen-printing for optimal performance.——————————————————————————————————————————————Features: low oil separation (almost 0), high-quality thermal paste, good reliability, strong weather resistance (high and low temperature resistance, moisture resistance, ozone resistance, aging resistance, etc.).Applications: 5G, automated driving systems, OnBoard Charger (OBC), servers, ICs, CPU, GPU, MOS, LEDs, communication equipment, virtual reality (VR).
